摘要
深微孔蟹脚及镀层结晶异常是电镀过程中常见的缺陷,其对PCB产品的可靠性具有重大的影响。文章采用有限元分析的方法,对侧喷时PCB板面及孔内的镀液流动状态进行了数值计算,得到了不同喷流速度、不同厚径比时镀液在深微孔底部的速度分布数据;另外通过试验研究了电流密度、波形时间比、正反电流比等电镀参数对深微孔电镀效果的影响,结果显示当电镀参数与喷流频率进行协同作用时,深微孔产品的蟹脚、结晶异常类缺陷能够得到有效改善。
Deep microporous crab legs and abnormal crystallization of coating are common defects in the electroplating process,which have significant impact on the reliability of PCB products.The article uses the method of finite element analysis to numerically calculate the flow state of the plating solution on the PCB surface and in the hole during side spraying,and obtains the velocity distribution of the plating solution at the bottom of the deep microhole under different jet velocities and different thickness-to-diameter ratios data.In addition,the influence of electroplating parameters such as current density,waveform time ratio,positive and negative current ratio on the effect of deep microporous electroplating is studied through experiments.The results show that when electroplating and jet flow parameters are synergistic,these defects can be effectively improved.
作者
王康磊
宋伟伟
焦小山
Wang Kanglei;Song Weiwei;Jiao Xiaoshan
出处
《印制电路信息》
2023年第S01期196-206,共11页
Printed Circuit Information
关键词
深微孔
蟹脚改善
有限元分析
喷流模型
Deep Micro-Holes
Crab Feet Improvement
Finite Element Analysis
Jet Model
