摘要
刚挠结合板具有"模块化设计"和"三维安装"等特性,随着电子产品市场的快速增长,信息产品走向高速化,刚挠结合板也必将朝着高速传输的道路发展。在信号高速传输中,阻抗匹配至关重要,文章从高速刚挠结合板的阻抗影响因素入手,分析各因素对阻抗的影响,对制造过程进行控制并进行过程能力CPK分析,使得加工阻抗值与设计值控制一致,实现此类小批量产品阻抗公差控制在±5%。
Rigid-flex board has the characteristics of"modular design"and"three-dimensional installation".With the rapid growth of the electronic product market,information products are moving towards high-speed,rigid-flex board will also develop towards high-speed transmission.In the high-speed signal transmission,impedance matching is very important.This article starts with the impedance influence factors of the high-speed rigid-flex board,analyzes the influence of each factor on the impedance,controls the manufacturing process and conducts the process capability CPK analysis,so that the processing impedance value is consistent with the design control value,and the impedance tolerance of such small batch products is controlled within±5%.
作者
马点成
刘敏
吴军权
陈春
Ma Diancheng;Liu Min;Wu Junquan;Chen Chun
出处
《印制电路信息》
2021年第S02期220-227,共8页
Printed Circuit Information
关键词
高速刚挠结合板
±5%阻抗控制
阻抗仿真
挠性区阻抗
High-Speed Rigid-Flex Board
±5% Impedance Control
Impedance Simulation
Flexible Zone Impedance
