摘要
随着电子产品的不断更新换代,其对印制电路板外形的需求越来越多。从以往的研究中可以得出,在印制电路板加工过程中,其表面不会绝对平整,而平整度的大小可以衡量印制电路板表面的平整程度。平整度数值越小,表明其表面越平整,在后制程SMT(表面贴装)时也有利于器件与印制电路板的结合,得到的产品可靠性也越强。但当器件存在一定的翘曲时,此结论则不适用,此时印制电路板与器件的翘曲方向一致时二者结合的最紧密。而现在还未有实现印制电路板定向翘曲的研究,因此文章利用不同组合的半固化片,进行不对称压合,在压合过程中不同型号的半固化片冷却时产生的收缩力不同,可通过此种现象来探究实现印制电路板的定向翘曲。
With the continuous upgrading of electronic products,the demand for the appearance of the printed circuit board is increasing.It can be concluded from previous studies that in the process of printed circuit board processing,the surface will not be absolutely flat,and the value of flatness can reflect the smooth of the surface of printed circuit board.The smaller of the value of flatness indicates that the surface of the printed circuit board is smoother,which is also beneficial to the combination of the device and the printed circuit board in the post-process SMT(Surface Mounted technology),and the product reliability is stronger.However,this conclusion is not applicable when the device has a certain degree of warpage.At this time,the printed circuit board and the device are tightly bonded when the warpage direction of the device is the same as printed circuit board.In addition,there is no research to realize the directional warpage of printed circuit boards.Therefore,in this paper,the author used different combinations of prepregs to achieve asymmetric laminating.During the laminating process,different types of prepregs produce different shrinkage forces when they are cooled.What’s more,in this way,the author can explore how to achieve the directional warpage of the printed circuit board.
作者
彭家奕
唐昌胜
Peng Jiayi;Tang Changsheng
出处
《印制电路信息》
2021年第S02期85-91,共7页
Printed Circuit Information
关键词
印制电路板
平整度
定向翘曲
半固化片
不对称压合
Circuit Printed Board
Flatness
Directional Warpage
Prepregs
Asymmetric Laminating
