摘要
DIMM槽孔上锡不良和焊接空洞问题是较严重的PCB质量问题,DIMM槽孔上锡不良会导致焊点的机械强度下降,甚至影响导电性能不良。文章主要对DIMM槽插件孔出现上锡不良的失效分析方法做了深度的分析;对常见的上锡不良失效案例进行解析说明,找到对DIMM槽插件孔上锡不良的原因,并建立有效的分析步骤和方法,快速的对不良失效原因定位,并准确地作出下一步的预防改善措施。
The problem of bad tin eating and welding hole in DIMM slot of server board is a serious PCB quality problem.The poor filling of DIMM slot will lead to the decrease of mechanical strength of solder joint and even affect the poor electrical conductivity.The article made deep analysis to the bad failure analysis method for the server board DIMM slot plug-in hole eating tin problem,analyzed and explained the common bad tin eating failure cases,found out the bad tin eating reasons for the DIMM slot plug-in hole,and established effective analysis steps and methods,quickly located the bad failure reasons,and accurately made the next step of prevention and improvement measures.
作者
黎建昌
郭庭虎
陈伟才
Li Jiangchang;Guo Tinghu;Chen Weicai
出处
《印制电路信息》
2021年第S02期337-346,共10页
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