摘要
文章研究刚挠结合板溢胶超标改善工艺,目前行业中刚挠结合板类型的产品叠构层间基本是使用lowflow半固化片材料,lowflow半固化片材料在经过基材传压就会有树脂胶产生。溢胶是刚挠结合板重要控制项目之一,由于溢胶超标直接影响到产品性能和外观,降低挠性板弯折次数。文章针对树脂溢胶问题点进行系统性讨论分析,提出对应改善方案对策,经过实验测试,证明了该方案有效,并应用到批量生产中。
This paper studies the improvement process of glue overflow of Rigid-flex PCB.At present,1 owflow PP is basically used in the laminated layer of Rigid-flex PCB.Resin glue will be produced when low flow PP passes through the laminate press.The poor glue overflow is one of the important control items of rigid Flex PCB.The excessive glue overflow directly affects the product performance and appearance,and it reduces the bending times of flexible area.This paper systematically discusses and analyzes the problems of resin overflow,and puts forward the corresponding improvement measures.The experimental test proves that the scheme is effective and has been applied to mass production.
作者
赵永兴
赖艳玲
王传兵
陈胜华
韩志伟
徐缓
Zhao Yongxing;Lai Yanling;Wang Chuanbing;Chen Shenghua;Han Zhiwei;Xu Huan
出处
《印制电路信息》
2021年第S01期179-186,共8页
Printed Circuit Information
基金
梅州市引进重大科技创新平台和项目——基于5G通讯终端高速高散热印制电路关键技术及产业化(项目编号:2019A0102002)支持
关键词
高温PI阻胶膜
溢胶
抗蚀刻油墨
High Temperate Resist PI Film
Glue Overflow
Corrosion Resistance Ink
