摘要
先进封装技术持续朝着连接密集化、堆叠多样化和功能系统化的方向发展,探索了扇出型封装、2.5D/3D封装、系统级封装等多种封装工艺。晶圆微凸点技术已被广泛应用于各种先进封装工艺中,是最重要的基础技术之一。本文介绍了微凸点制备的主要技术并进行优劣势比较,同时详述了锡球凸点和铜柱凸点两种不同的微凸点结构,为微凸点技术的更深入研究提供参考。最后,本文整理了微凸点技术在先进封装中的应用,并展望了未来的发展趋势。
Advanced packaging technologies are getting more and more connection-dense,stacking-diversified,and functionally systematized.A variety of packaging processes have been developed,such as fan-out,2.5D/3D,and system-in-package.Wafer micro-bumps one of the most important technologies,has been widely used in various advanced packaging processes.In this paper,the main techniques of micro-bump preparation are introduced,and the advantages and disadvantages are compared.At the same time,two different micro-bump structures,namely,tin ball bump and copper pillar bump,are discussed to provide a reference for more in-depth research on micro-bumps.Finally,the applications of micro-bumps in advanced packaging are summarized in this paper,and the tendency of development in the near future is predicated.
作者
刘冰
夏良
贺京峰
孔云
陈平
LIU Bing;XIA Liang;HE Jingfeng;KONG Yun;CHEN Ping(Guizhou Zhenhua Fengguang Semiconductor Co.,Ltd,Guiyang 550018,China)
出处
《微纳电子与智能制造》
2024年第1期1-11,共11页
Micro/nano Electronics and Intelligent Manufacturing
关键词
先进封装
微凸点
制备技术
凸点结构
advanced packaging
micro-bumps
preparation techniques
bump structures
