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子孔径柔性抛光工具影响函数的轨迹密度影响规律

The Influence Law of Sub-aperture Flexible Polishing Tool Influence Function Track Density
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摘要 高能激光系统对磁流变抛光的表面完整性控制能力要求极为苛刻,目前的磁流变子孔径抛光控制算法对于工具影响函数布置密度的影响规律尚不明确。为进一步阐明轨迹密度的影响规律,首先分析了子孔径抛光的工艺特性,分析了工具影响函数对光学元件面形创成的工艺特性;然后,建立了工具影响函数对抛光过程的确定性影响机制,得到了密度参数对抛光结果的影响机制;根据工艺控制机制,分析了轨迹密度对最终面形误差的影响规律。最后,通过对平面、非球面、CPP面形的加工计算,验证了3种面形情况下的子孔径加工均满足这一规律。 High-energy laser systems have extremely stringent requirements for the surface integrity control ability of magnetorheological polishing.The current magnetorheological sub-aperture polishing control algorithm has an unclear influence on the density of tool influencing functions.In order to further clarify the influence of track density,we first analyzed the process characteristics of sub-aperture polishing,and studied the process characteristics of the tool influence function on the surface shape creation of the optical element.Then,the deterministic influence of the tool influence function on the polishing process was established.The influence mechanism of the density parameter on the polishing result was obtained.Further,according to the process control mechanism,the influence law of the track density on the final surface shape error was analyzed.Finally,through the processing calculations of plane,aspheric,and CPP surface shapes,it is verified that the sub-aperture processing in the three surface shapes meets this rule.
作者 杨航 罗科 黄文 贾阳 YANG Hang;LUO Ke;HUANG Wen;JIA Yang(School of Engineering,Zunyi Normal University,Zunyi 563006,China;Institute of Mechanical Manufacturing Technology,China Academy of Engineering Physics,Mianyang 621900,China;Huazhong Institute of Optoelectronics Technology Wuhan National Laboratory of Optoelectronics,Wuhan 430073,China)
出处 《武汉理工大学学报》 CAS 2021年第7期76-80,共5页 Journal of Wuhan University of Technology
基金 国家“高档数控机床与基础制造装备”科技重大专项(2017ZX04022001) 遵义市科技局科技研发项目(遵市科合HZ字[2020]21号) 贵州省基础研究计划(黔科合基础-ZK[2021]一般272)
关键词 磁流变抛光 子孔径抛光 工具函数 工艺特性 密度机制 magnetorheological polishing sub-aperture polishing tool function process characteristics density mechanism
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