摘要
在集成电路封装中,分层是一个很普遍的现象,同时又是导致集成电路失效的主要原因之一。所谓分层泛指集成电路封装中不同材料之间的界面分离,以及同种材料内部的空洞。针对不同的封装,总结了扫描声学显微镜及X-ray检测系统(包括2D、3D)两种无损检测分层现象的方法。并在此基础上,结合失效分析案例,阐述了两种方法在失效分析过程中的应用,以及分层导致集成电路失效的机理。
Delamination is a common pheno menon in IC packaging,and it is also one of the main causes of IC failure.The delamination generally refers to the interface separation between different materials and the cavities in the same material in IC packaging.For different packages,two nondestructive testing layering methods of SAM and X-ray testing system(including 2D and3D)are summarized.On this basis,combined with failure analysis cases,the application of the two methods in the process of failure analysis,and the mechanism of IC failure caused by delamination are expounded.
作者
杨妙林
任瑛
YANG Miaolin;REN Ying(CEPREI,Guangzhou 511370,China)
出处
《电子产品可靠性与环境试验》
2022年第S01期36-40,共5页
Electronic Product Reliability and Environmental Testing
