摘要
基于电弧增材制造工艺,结合拓扑优化结果对某半导体晶圆检测设备内的龙门框架进行二次设计,确定了以辅助基板作为支撑的连续变位成型方法,并对电弧熔丝龙门框架实物进行模态仿真与实测。结果表明:通过电弧增材制造工艺成型的龙门框架刚度性能与锻件无明显差异,相较于传统焊接龙门架重量减轻了26%,约束模态提高了15%,能够满足高刚度轻量化的工程应用需求。
This paper studies the redesign of platform gantry in semiconductor wafer inspection equipment based on topology optimization method.The redesigned platform gantry is manufactured with Wire and Arc Additive Manufacturing(WAAM)process via special consecutive positioning method based on an auxiliary plate.The model of the final product is studied and verified in the simulation experiment and real test.The results show that the stiffness performance of WAAM parts and forge pieces is similar.Compared to traditional welded one,the optimized WAAM platform gantry achieves a weight loss of 26%,and a constrained modal increase of 15%,meeting the high stiffness and lightweight requirement of engineering application.
作者
刘剑
LIU Jian(Shanghai Micro Electronics Equipment(Group)Co.,Ltd,Shanghai 201203,China)
出处
《电子技术（上海）》
2019年第1期60-62,共3页
Electronic Technology
基金
上海市高科技企业技术创新课题项目.
关键词
集成电路制造
增材制造
龙门架
拓扑优化
模态
integrated circuit manufacturing
additive manufacturing
platform gantry
topology optimization
modal
