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多维数字补偿电流/频率转换器系统级封装技术

System in a Package Technology of Multi-dimensional Digital Compensation Current/frequency Converter
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摘要 在航空航天、工业自动化等领域,电流/频率转换器主要是对加速度计等电路输出电流进行高精度测量。随着工业技术的发展,对电流/频率转换器的小体积和高性能提出了越来越高的需求。在典型电荷平衡式拓扑结构基础上,提出了一种新的融合模拟电路及多维数字算法补偿的电流/频率转换电路拓扑方案。其引入分流电路,采用改进的展宽复位逻辑控制算法,并利用单片机进行标度因数温度补偿、非线性补偿和零偏补偿,产品性能较原方案提升1~2个数量级。在工艺结构设计方面,为减小产品体积,对部分子电路进行了多芯片组件系统级封装(System in a Package,SiP)集成设计,通过优化布局布线并对数字板和模拟板进行三维堆叠组装,相对便捷地实现了电路的小型化设计。经数轮迭代,研制的产品经测试性能优异,非线性度小于1.5×10^(-5),零偏小于6nA,标度因数温度系数小于1×10^(-7)/℃,尺寸仅为80mm×60mm×15mm。 The current/frequency converter is mainly used to measure the output current of accelerometers and other circuits with high precision in many fields such as aerospace and industrial automation.With the development of industrial technology,it puts forward increasing demand of high performance and little volume size of current/frequency converter.A new current/frequency converter topology scheme combining analog circuit and multi-dimensional digital algorithm compensation is proposed based on the traditional balanced topology.In this paper,a shunt circuit is introduced,the improved extended width reset logic control algorithm is adopted,and a micro control unit is used for scale factor temperature compensation,nonlinear compensation and zero offset compensation,which improves 1~2 orders of magnitude compared with the original scheme.In terms of process structure design,in order to reduce product volume,system in a package(SiP)integration design of the multi chip module is carried out for some sub circuits.By optimizing the layout and wiring,and with the digital board and analog board designed for three-dimensional stacking and assembly,it is relatively convenient to realize the miniaturization design of the circuit.After several rounds of iteration,the developed product has excellent performance after testing,the nonlinearity is less than 1.5×10^(-5),the zero offset is less than 6 nA,scale factor temperature coefficient is less than 1×10^(-7)/℃,and the size is only 80 mm×60 mm×15 mm.
作者 汪金华 潘协根 沈时俊 庄永河 李鸿高 WANG Jin⁃hua;PAN Xie⁃gen;SHEN Shi⁃jun;ZHUANG Yong⁃he;LI Hong⁃gao(Anhui Province Key Laboratory of Microsystem,the 43rd Research Institute of CETC,Hefei 230088;Changqing Oilfield Branch Machinary Manufactruing General Factory,Xi’an 710200)
出处 《导航与控制》 2022年第3期85-91,共7页 Navigation and Control
关键词 电流/频率转换器 数字算法补偿 系统级封装 三维堆叠 current/frequency converter digital algorithm compensation system in a package(SiP) three-dimensional stacking
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