摘要
在分析微细电铸的电场与流场特性的基础上,深入研究了铸层厚度的不均匀现象及搅拌方式和电流密度对微细电铸质量的影响。由于高深宽比胶膜的存在,单一搅拌对电铸区域的影响只集中在微区的入口部分,扩散过程成为金属沉积的限制性因素;随着胶膜深宽比的增大,电场等势线弯曲的程度加大,导致电铸微区内金属离子传输能力不均匀。实验表明:微细电铸过程中,搅拌速度提高并不能改善金属沉积的传质条件,辅助超声的复合搅拌在相同条件下能提高金属沉积速度,减少铸层缺陷;最佳电流密度不宜超过0.9~1.0 A/dm2。基于该项技术,实现了高分辨率、侧壁陡直金属微结构的电铸成型。
In order to improve the micro electroforming quality of a microstructure,the characteristics of the micro electroforming process were discussed systematically and the properties of the electric field and flow field were analyzed.The asymmetry of the electroforming and the effect of stirring mode and current density on the microstructure were studied in detail.From the experimental results,it can be concluded that the effects of the pure stirring reaches the entrance of the micro groove only,so that the diff...
出处
《光学精密工程》
EI
CAS
CSCD
北大核心
2008年第3期473-477,共5页
Optics and Precision Engineering
基金
国家自然科学基金资助项目(No.50375073)
