摘要
介绍了湿膜镀锡板图形电镀Cu/Sn过程中出现的圈状渗镀即渗锡问题及跟进过程,最后采取了一系列可行性措施使该问题得到了彻底解决。
This article mainly introduced circular seepage plating in Copper/Tin plating of liquid photoresist PCBand the process. A series of doable measures were taken to solve it entirely in the end.
出处
《印制电路信息》
2004年第3期41-43,共3页
Printed Circuit Information
关键词
湿膜
印制线路板
渗镀
liquid photoresist PCB seepage plating
