期刊文献+

循环加载下金属薄膜的裂纹萌生行为及其微观机制的研究 被引量:7

STUDY OF THE CRACK INITIATION BEHAVIOR AND ITS MECHANISM OF THIN METAL FILMS UNDER CYCLIC LOADING
下载PDF
导出
摘要 金属薄膜广泛应用于大规模集成电路及微机电系统 (micro electro mechanicalsystems ,MEMS)设备中 ,循环加载下薄膜的可靠性至关重要。本研究在聚合物基体上制备不同厚度的铜薄膜。研究它们在循环加载下的疲劳裂纹萌生行为及其机制。实验结果表明 ,薄膜厚度影响薄膜的循环应变局部化和裂纹萌生行为。随薄膜厚度的减小 ,裂纹萌生从厚薄膜中的挤出诱发的疲劳开裂方式逐步转向较薄薄膜中的界面诱发的疲劳开裂方式。由于基体的约束 。 Thin metal films are widely used in ultra-large scale integrated circuits and microelectromechanical systems (MEMS). The reliability of the metal films under fatigue load is very important. In this study, Cu films were prepared on the polyimide substrates. The fatigue crack initiation behaviour and its mechanism were investigated. The results show that cyclic strain localization and crack initiation behaviour are strongly affected by film thickness. With decreasing film thickness, crack initiation behaviour changes from the extrusion-induced fatigue cracking in the thicker films to the interface-induced fatigue cracking in the thinner films. The transition of the fatigue cracking behaviour is attributed to the change in dislocation structure with film thickness due to the substrate constraint.
作者 张广平
出处 《机械强度》 CAS CSCD 北大核心 2004年第z1期5-7,共3页 Journal of Mechanical Strength
关键词 金属薄膜 循环载荷 裂纹萌生 位错结构 尺寸效应 Metal film Cyclic loading Crack initiation Dislocation structure Size effect
  • 相关文献

参考文献6

  • 1[1]Spearing S M. Materials issues in microelectromechanical systems (MEMS).Acta Mater. ,2000,48:179 ~ 196.
  • 2[2]Read D T. Tension-tension fatigue of Cu thin films. Int. J. Fatigue, 1998,20(3) :203 ~ 209.
  • 3[3]Kraft O, Schwaiger R, Wellner P. Fatigue in thin films: lifetime and damage formation. Mater. Sci. Eng. A, 2001, 319-321:919~923.
  • 4[4]Schwaiger R, Kraft O. Size effect in the fatigue behavior of thin Ag films.Acta Mater. ,2003,51: 195 ~ 206.
  • 5[5]Schwalger R, Dehm G, Kraft O. Cyclic deformation of polycrystalline Cu films. Phil. Mag. A, 2003, 83(6): 693 ~ 710.
  • 6[6]Zhang G P, Schwaiger R, Volkert C A, Kraft O. Effect of film thickness and grain size on fatigue-induced dislocation structures in thin Cu films. Phil.Mag. Lett. ,2003,83(8) :477 ~ 483.

同被引文献60

引证文献7

二级引证文献42

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部