摘要
At present, the most common micro/nano-scale fabri ca tion processes include the plane silicon process based on IC technology, stereo silicon process, LIGA, quasi-LIGA based on near ultra violet deep lithography, MEMS, energy beam etching and micro/nano-machining, etc. A common problem for t hese processes is the difficulty to fabricate arbitrary form for 3-dimensional micro/nano-parts, devices or mechanisms. To develop advanced MEMS manufacturin g technology, and to achieve fabrication of true 3-dimensional parts, devices or mechanisms, this paper proposes a nanofabrication technology for rapid proto typing of 3-dimensional parts, using plasma chemical vapor deposition (PCVD). This process can be describes as follows: A laser beam is produced by a low power, quasi molecule laser. It enters the vac uum chamber through a window, and is focused on with the substrate surface. A ga s in the chamber is ionized by the laser beam to produce PCVD on the substrate s urface, and forms a particle of the size of Ф100 nm (its thickness is about 100 nm). When the laser beam moves along X-axis, many particles form a line. Then the laser beam moves one step in Y-axis to form a new line. A plane is complete d by many lines. Then the substrate moves in Z-axis to form new plane. Eventu ally, many planes form a 3-dimensional component. Using available CAD/CAM softw are with this process, rapid prototyping of complex components can be achieved. A nanometer precision linear motor, such as that described in Chinese national p atent (patent No. ZL 98 2 16753.9), can be used to obtain the nanometer precisio n movements in the process. The process does not require mask, can be used for v arious rapid prototyping materials, to obtain high fabrication precision (its sc ale precision is 15 nm), and larger ratio of height to width of micro/nano-stru cture. It can find widespread applications in the fabrication of micro-mechani sm, trimming IC, and fabricating minilens, etc.
At present, the most common micro/nano-scale fabri ca tion processes include the plane silicon process based on IC technology, stereo silicon process, LIGA, quasi-LIGA based on near ultra violet deep lithography, MEMS, energy beam etching and micro/nano-machining, etc. A common problem for t hese processes is the difficulty to fabricate arbitrary form for 3-dimensional micro/nano-parts, devices or mechanisms. To develop advanced MEMS manufacturin g technology, and to achieve fabrication of true 3-dimen...
出处
《厦门大学学报（自然科学版）》
CAS
CSCD
北大核心
2002年第S1期280-,共1页
Journal of Xiamen University：Natural Science
基金
ProjectsupportedbyNationalNaturalScienceFoundationofChina (5 980 0 1 5 0 )
