摘要
阐述了微波焊接过程中微波和物质作用的机理、陶瓷的升温特征、实验装置的优化以及近年来国内外微波焊接陶瓷的发展状况 ,分析了焊接过程中存在的问题 ,并对微波焊接作出了展望。
The interaction mechanism of microwave with ceramics, the characteristics of temperature change and the equipment of microwave joining were expatiated, and the development on microwave joining in recent years was provided, then some problems in the microwave joining process were refered. At last a prospect on microwave joining technology was made.
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
2001年第z2期16-20,共5页
The Chinese Journal of Nonferrous Metals
基金
武汉市晨光计划 (2 0 0 0 5 0 0 40 3 4)
关键词
微波焊接
陶瓷
介电损耗
microwave joining
ceramics
dielectric loss factor
