摘要
以具有低软化温度的ZnO-B2O3-SiO2(ZBS)玻璃和Al2O3为原料,用传统固相合成法制备ZBS-Al2O3微晶玻璃,并分别研究ZBS-Al2O3微晶玻璃的烧结特性、显微结构及性能。结果表明:随着玻璃含量的增加,ZBS-Al2O3微晶玻璃的烧结温度降低,介电常数(ε)先减小后增大,而绝缘电阻率(ρ)则相反,介电损耗(tanδ)、热膨胀系数(α)和硬度(Rh)均减小。0.7ZBS-0.3Al2O3的微晶玻璃具有最佳综合性能:烧结温度为950℃,1MHz下的ε=6.5,tanδ=0.8×10-3,ρ=2.64×1013Ωcm,α=5.42×10-6K-1,Rh=595MPa,达到了电子封装基板材料的要求。
Al2O3 ceramics with different amounts of ZnO-B2O3-SiO2(ZBS) glass addition were prepared by a traditional solid solution process.The sintering behavior,microstructure and properties of ZBS-Al2O3 glass-ceramics were investigated.The results show that with the increase of glass content,the sintering temperature of glass-ceramics decreases,dielectric constant(ε) increases first and then decreases,while the insulation resistivity(ρ) exhibits the opposite trend.Additionally,the dielectric loss(tan δ),thermal exp...
出处
《硅酸盐学报》
EI
CAS
CSCD
北大核心
2009年第3期409-413,共5页
Journal of The Chinese Ceramic Society
基金
西北工业大学科技创新基金(2006CR11)资助项目
关键词
微晶玻璃
烧结特性
介电性能
尖晶石结构
glass-ceramics
sintering behavior
dielectric properties
spinel structure
