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Investigation on Bodily Fault in Doped W Wire by Electronic Miscroscope

Investigation on Bodily Fault in Doped W Wire by Electronic Miscroscope
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摘要 The forming process of the bodil y fault in doped W wire was observed by SEM and TEM. The forming kinetics was de scibed by the perturbing theory. The interaction among the bodily fault and the dislocation or the grain boundary was also observed. The strengthen effect cause d by the interaction is counted initially by each submitted probable models. The results show that the strengthening mechanism at middle and high temperature is different. The forming process of the bodil y fault in doped W wire was observed by SEM and TEM. The forming kinetics was de scibed by the perturbing theory. The interaction among the bodily fault and the dislocation or the grain boundary was also observed. The strengthen effect cause d by the interaction is counted initially by each submitted probable models. The results show that the strengthening mechanism at middle and high temperature is different.
出处 《Journal of Iron and Steel Research International》 SCIE EI CAS CSCD 2000年第1期48-51,共4页
关键词 doped W wire K tube bodily fault pertubing ki netics doped W wire;K tube;bodily fault;pertubing ki netics
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