摘要
以塑料微流控芯片的热压加工技术为基础,以实现自动化和批量化为目标,对芯片热压键合设备的机械结构进行设计研究,在保证芯片受压均匀的情况下,对设备机身的结构、加压方式等进行了分析,确定设备机身采用闭式双立柱结构,上部加压方式,通过力矩电机、螺旋升降机带动压头完成压力输出,并对压头的运动进行导向。实验表明,在热压芯片时,该设备能够将优化的工艺参数复现,制作的芯片质量稳定,一致性好。
The mechanism of hot embossing and bonding machine for fabricating microfludic chips were designed by polymer hot embossing technique so that the machine can work automatically and be numerically controlled.To ensure uniform distribution of a force on chips,the construction of the machine body and the way of application of the force were studied.So,a closed frame with double vertical shafts was adopted for the machine body.The force was applied by a top model and it was exported from an anvil driven by a motor-operated screw elevator.Simultaneously,the motion of the anvil was guided by the elevator.The experimental results indicate that the optimized parameters are repeated by the machine and the stable and homogenous chips are obtained.
出处
《微细加工技术》
2006年第3期58-61,64,共5页
Microfabrication Technology
