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高速雪崩光探测器同轴封装的高频分析 被引量:5

High Frequency Analysis of TO Packaging for High-speed Avalanche Photodetectors
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摘要 基于频率响应理论模型,分析了同轴封装的雪崩光电探测器的高频特性.包含芯片、键合金丝、跨阻放大器和同轴管座等各部分的高频特性及对器件高频特性的影响.通过调节封装过程中不同键合金丝引入的电感参量,可以得到不同现象的频率响应.最后考虑实际工程条件,优化得到了10GHz的-3dB带宽的同轴封装雪崩光电探测器件. Based on the frequency response model,high frequency characteristic analysis for the TO packaged avalanche photodetectors is presented.The influence on frequency performance of TO packaging,including chip,bondwire,transimpedance amplifer,and TO header elements are investigated.By changing inductance parameters induced by different bandwires,the different frequency responses are observed.Finally,by considering the engineering conditions,a-3 dB bandwidth of 10GHz is optimally obtained for TO packaging.
出处 《光子学报》 EI CAS CSCD 北大核心 2012年第2期240-243,共4页 Acta Photonica Sinica
基金 高等学校优秀青年人才基金项目(No.2009SQRZ099) 国家高技术研究发展计划项目(No.2007AAJ218)资助
关键词 雪崩光电探测器 同轴封装 频率响应 跨阻放大器 Avalanche photodetector TO can packaging Frequency response Transimpedance amplifer
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  • 1张永刚,单宏坤,周平,富小妹,潘慧珍.掺铁InP肖特基势垒增强InGaAs MSM光电探测器[J].光子学报,1995,24(3):223-225. 被引量:5
  • 2Chen ZhiMing, Pu Hongbing,Fred R. et al. A light-activated SiC darlington transistor using SiCGe as base layer. Chin Phys Lett, 2003,20 ( 3 ): 430 ~ 432.
  • 3Katulka G, Roe K, Kolodzey J, et al. The electrical characteristics of silicon carbide alloyed with germanium.Applied Surface Science, 2001, (175-176): 505 ~511.
  • 4Pankov J I. Optical Processes in Semiconductors. Englewood Clifts, Prentice-Hall, 1971.38.
  • 5Solangi A M I. Absorption coefficient of a - SiC grown by chemical vapor deposition. J Mater Res, 1991,7 (3) :539 ~544.
  • 6Braunstein R, Moore A R, Herman F. Intrinsic optical absorption in germanium-silicon alloys. Phys Rev, 1958,109(3): 695 ~710.
  • 7Orner B A,Kolodzey J. Si1-x-yGexCy alloy band structures by linear combination of atomic orbitals. J Appl Phys, 1997,81(10): 6773 ~6780.
  • 8Chou S Y, Liu M Y. Nanoscale tera-hertz metalsemiconductor-metal photodetectors. IEEE J . Quantum Electron., 1992, 28(10):2358-2368.
  • 9Krems T, Haydl W, Massler H a al.. Millimeter-wave performance of chip interconnections using wire bonding and flip chip. IEEE MTT-S Int. Microwave Syrup. Dig. , 1996,1(6) :247-250.
  • 10Budka T P. Wide-bandwidth millimeter-wave bond-wire interconnects. IEEE Trans. .Microwave Theory Technol.,2001, 49(4) :715-718.

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