摘要
本文结合生产实际,经过三个月的试验评估和后续生产监控,采用T260测试方法,在层压制程后取样,从影响PCB分层的不同板面氧化处理方式以及压板参数入手,对T260值进行了系统分析,初步得出S7、SO、M三种板材层压后在制品T260值评估标准。同时指出取样位置不同对T260值无明显影响,初次建立了PCB耐热性T260评估标准。
Based on the experience in actual production,this paper drew a preliminary standard on the thermal resistance performance evaluation of three common used materials,by means of T260 test method. From the viewpoint of innerlayer copper surface treatment and press parameter,the author analyzed the factors that may influence time to delamination,and pointed out that different sample position may not effect the outcome of T260 value.
出处
《印制电路信息》
2009年第S1期508-513,共6页
Printed Circuit Information
关键词
T260标准
PCB耐热性
分层失效判断标准
T260 standard
PCB's heat-resistant
Judgment standards of delamination failure
