期刊文献+

常温Ni—P合金化学镀液的研究

Studies On Electroless Ni-P Alloy Plating Bath of Normal Atmospheric Temperature
下载PDF
导出
摘要 本文报导一种常温Ni—P合金化学镀液新配方及各种因素对沉积速度的影响。从吸附的观点出发,提出了新的化学镀沉积机理,同时对含磷量的控制作了初步探讨,从而认为在常温条件下,只有在碱性镀槽中才能上镀,而非晶态Ni—P合金镀层只能在酸性镀槽中形成,选择合适的值,可制取非晶态镀层。 The article introduces a new direction for producing the electroless nickel-phosphorus alloy plating bath used in the room temperature. We have stuied the different factors influencing the depositing rate. A new deposition mechanism of the electoless Ni-P alloy plating was developed from the point of view of absorption and the way of controlling quantity of phosphor in coating was discussed. Our conclusion is that to be coating in the common temperatare are only in base plating bath, the amorphous Ni-P alloy coating is formed only in acid plating bath and will be obtained by selecting the proper values of ratio η=[H2PO2-]/[Ni2+].
出处 《佛山科学技术学院学报(社会科学版)》 1992年第6期32-37,共6页 Journal of Foshan University(Social Science Edition)
关键词 化学镀 镍磷合金 非晶态 electroless plating, nickel-phosphorus alloy, amorphous solid
  • 相关文献

参考文献2

二级参考文献1

  • 1方景礼.日本化学镀发展概况[J]电镀与环保,1986(03).

共引文献12

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部