摘要
金刚石/铜复合材料具有低膨胀系数和高热导率等优异性能,使其成为一种理想的电子封装材料。采用97%(72Ag-28Cu)-3%Ti活性钎料对金刚石/铜复合材料和氧化铝陶瓷进行钎焊。发现活性钎料在氧化铝陶瓷和金刚石薄膜表面均具有良好的润湿性,在两者表面的平衡润湿角均小于5°。讨论了主要钎焊条件(如钎焊温度和保温时间等)对接头性能的影响。发现钎焊过程中Ti元素聚集在金刚石颗粒的表面形成TiC化合物,且TiC化合物的形貌与钎焊接头的剪切强度具有紧密联系。推测合适的TiC化合物层厚度可改善钎焊接头的剪切强度,而颗粒状的TiC化合物及过厚的TiC化合物层却会损害钎焊接头的性能。获得的最大剪切强度为117MPa。
The novel properties of diamond/Cu composites such as low thermal expansion coefficient and high thermal conductivity have rendered the composites a valuable packaging material. The reactive brazing of diamond/Cu composites and alumina was performed using the 97%(72Ag?28Cu)?3%Ti alloy. The reactive brazing alloy displays good wettability with alumina and diamond film, and the equilibrium contact angle on both the substrates is found to be less than 5o. The influence of main bonding conditions such as peak heating temperature and holding time was investigated in detail. It is found that Ti element concentrates at the surface of diamond particle resulting in the formation of TiC compound. The morphology of TiC compound exhibits a close relationship with the shear strength of brazing joint. It is surmised that an optimal thickness of TiC layer on the diamond particle surface can ameliorate the shear strength of brazing joint. However, on the contrary, the particle-like shaped TiC compound or a thicker TiC compound layer can impair the shear strength. The maximum shear strength is found to be 117 MPa.
出处
《中国有色金属学会会刊：英文版》
CSCD
2013年第6期1701-1708,共8页
Transactions of Nonferrous Metals Society of China
基金
Project(51204016)supported by the National Natural Science Foundation of China
Project(20120006120011)supported by the Specialized Research Fund for the Doctoral Program of Higher Education of China
Project(FRF-TP-12-154A)supported by the Fundamental Research Funds for the Central Universities,China
Project(11175020)supported by the National Science Foundation for Post-doctoral Scientists of China
