摘要
对KF-B_2O_3-K_2WO_4熔盐体系的电镀钨工艺进行了详细研究。实验条件如下,温度:770~990℃,K_2WO_4浓度:9~20m/o,基体材料:钼、铜、镍和不锈钢。实验结果表明:在较高温度(T=850~900℃)和较低阴极电流密度下可获得平整光滑、呈银灰色的钨镀层。XRD分析表明,钨沉积过程中形成的织构方向与基体材料有关。
Electroplating of tungsten in molten KF-B_2O_3-K_2WO_4 was investigated. The conditions of electroplating were as follows: temperature of melt: 770~900℃, concentration of K_2WO_4: 9~20m/o, substrate: molybdenum, copper, nickel or stainless steel. The experimental results show that a smooth, dense and adherent tungsten coating can he obtained at higher temperatures (850~900℃) and lower cothodic current densitis. Analysis of x-ray diffraction indicates that texture of the tungsten deposit depends on the substrate.
出处
《电镀与精饰》
CAS
1993年第6期3-7,16,共6页
Plating & Finishing
基金
国家自然科学资金
关键词
熔盐
电镀
镀钨
electroplating in molten salts, KF-B_2O_3-K_2WO_4melt, tungsten coating