摘要
本文研究了树脂基复合材料热导率,提出了环氧树脂中加入填料的新导热模型。该模型基于复合材料理想的水平和垂直导热模型,考虑了影响材料导热的多种因素,并加以修正。新模型推出的导热方程:ln(K_c)=G(f)×ln(K_V)+[1-G(f)]×lnK_h,一旦所有影响材料导热的参数被确定,就能核算材料的导热率,模型计算值与实验数据相一致。
In the study, a new thermal conduction model is proposed for filled Epoxy resins with metal particles. The modelis fundamentally based on the generalization of vertically and horizonally ideal conduction model of composites and is modified in considering that the parameters have influn-cences on thermally conductive composites. The following equation is cer-ived from the new model: ln(Kc.) =G(f) × ln(Kv) + [1-G(f)] × ln(Kh). Once all parameters are known, the thermal conductivity of resin compo-sites filled with particles can be evaluated. The calculated values coincide with the experimental data.
出处
《复合材料学报》
EI
CAS
CSCD
北大核心
1993年第3期19-24,共6页
Acta Materiae Compositae Sinica
关键词
导热
树脂
复合材料
thermal conductivity, polymer, composite
