摘要
踏入21世纪,环境保护已成为国家可持续发展策略的一部分;由于铅污染环境并严重影响人类和牲畜的生存质量,因此对使用有铅焊料的电子产业,迫切需要研究开发出新型的无铅焊料;而Sn-Zn无铅焊料是一种有希望取代传统铅锡焊料的合金。综述了SnZn合金的研究成果,主要分析了该合金系中各元素的作用和焊接后的界面情况,并提出了改进Sn-Zn合金的方向。
Environment protection has been a part of state sustainable development.As lead pollutes environment and do harm to the health of human and animals,the use of lead solder is limited.It is necessary for the electronic industry to develop a new lead-free solder.Sn-Zn alloy is a candidate for the traditional lead-tin solder substitute.The research of Sn-Zn has been reviewed.The effect of elements in the alloy and the interface between solder and substrate after soldering have mainly been discussed. Some suggestions for improving the performance of Sn-Zn alloy has been presented.
出处
《电子工艺技术》
2004年第4期150-153,共4页
Electronics Process Technology
关键词
Sn—Zn合金
电子材料
lead-free solder
Sn-Zn alloy
Electronic material
