摘要
砂轮划片机划切技术的研究和应用直接关系到设备应用的好坏。对划切中关键的参数主轴转速、划切速度、基片固定、刀片等进行了系统分析研究,具有指导性地提出了选择该类参数的方法。
The research and application on dicing technology of wheel wafer dicer directly decides the relevant equipment application status. The paper analyzes and studies the key parameters of dicing process, such as turning speed of spindle, dicing speed, mounting method of substrate and blade, etc., and proposes the guideline of choosing the above parameters.
出处
《电子工业专用设备》
2004年第9期68-71,共4页
Equipment for Electronic Products Manufacturing
关键词
主轴
刀片
冷却
基片固定
划切速度
Spindle
Blade
Coolant
Substrate mounting
Dicing speed
