摘要
通过高精度压力传感器、薄膜温敏传感器和管式应变计传感器的电子束封装焊接实践,讨论了电子束焊在超薄精密传感器封装焊接中需要注意的工艺因素。
Experimental sealling with EBW are carried out for high accurate pressure transducer, thin-film temperature sencer and tube shape strain transducer etc. The good results are presented in using EBW process for sealling the ultrathin accurate sencers and transducers.
出处
《焊接》
北大核心
1993年第3期17-19,共3页
Welding & Joining
