摘要
采用真空扩散焊技术对Mg/Al异种材料进行了焊接。采用金相显微镜、扫描电镜 (SEM)、显微硬度计及X射线衍射 (XRD)对扩散界面附近的显微组织及性能进行了试验研究。试验结果表明 ,Mg/Al异种材料真空扩散焊在加热温度Tp=4 5 0～ 4 90℃ ,压力强度P =0 .0 8～ 0 .10MPa ,保温时间t=4 0～ 6 0min时能得到良好的扩散焊接头。扩散焊界面过渡区形成了致密的新相化合物层 ,断口形貌呈粗糙暗灰色 ,以解理断裂为主并伴有脆性的混合型断口 ,扩散界面过渡区生成了MgAl、Mg3 Al2 、Mg2 Al3
Magnesium ( Mg1 ) and aluminum ( 1070 A) were bonded by vacuum diffusion bonding technology. The microstrueture of the Mg/Al diffusion bonded joint was studied by means of metallography, micro-hardness test, scanning electron microscope and X-ray diffraction. The diffusion bonding parameters : the heat temperature T_p = 450 - 490 ℃,the pressure P = 0.08 - 0.10 MPa, the holding time t = 40 - 60 min.The experiment results indicated that the new compact phase was formed in the transition zone of Mg/Al diffusion bonded joint. The fracture morphology of Mg/Al diffusion bonded joint mainly consists of coarse and gray fracture, and the fracture is mainly the mixed fracture of cleavage.There are the intermetallic compounds MgAl, Mg_3Al_2 and Mg_2Al_3 in the diffusion transition zone.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2004年第5期5-8,共4页
Transactions of The China Welding Institution
基金
国家自然科学基金资助项目 ( 5 0 3 75 0 88)
山东省自然科学基金资助项目 (Y2 0 0 3F0 5 )
关键词
Mg/Al异种材料
显微组织
断口
真空扩散焊
Mg/Al dissimilar materials
microstructure
fracture
vaccum diffusion bonding
