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UHV/CVD生长亚微米薄硅外延层及其高频器件研制 被引量:6

Sub-micron silicon epilayer deposited by a novel Ultrahigh Vacuum Chemical Deposition System and fabrication of high frequency device
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摘要 为获得亚微米级的薄硅外延层,从而提高硅器件的工作频率,利用自行研制的一台新型超高真空化学气相沉积(UHV/CVD)系统生长用于高频器件的超薄外延层,该系统由气路部分、控制部分、主体部分组成,反应室本底真空可达5.0×10-8Pa,能够实现在超净环境下低温、低压外延生长.利用该系统在重掺硅衬底上成功生长出了高质量的亚微米薄硅单晶层,外延层厚度为0.1~0.5μm,掺杂浓度为1×1017cm3,过渡区非常窄,达到了制备高频器件的要求;并在此基础上制备出了高频肖特基二极管原型器件,由IV测试并经过计算,截止频率可达31GHz. To obtain ultrathin epilayers which are used to improve high frequency characteristic of silicon based devices, a new approach to grow sub-micron silicon epilayer is developed by a novel ultrahigh vacuum chemical vapor deposition system consisting of three chambers and a computer-controlled gas distribution. The base pressure of the reaction chamber could reach 5.0×10-8 Pa. With this system, the sub-micron silicon epilayer is successfully deposited at 600°C. The thickness and carrier concentration of the epilayer is about 0.1-0.5 μm and 1×1017 cm3, respectively. Using the above sub-micron silicon epilayer, a prototype Schottdy Barrier diode is fabricated, whose calculated cutoff frequency could reach 31 GHz.
出处 《浙江大学学报(工学版)》 EI CAS CSCD 北大核心 2004年第10期1248-1251,共4页 Journal of Zhejiang University:Engineering Science
基金 国家科学技术部攀登项目 浙江省计划资助项目(981101040 991110535).
关键词 超高真空化学气相沉积 硅外延层 亚微米 高频 肖特基二极管 Current voltage characteristics Epitaxial growth Schottky barrier diodes Semiconducting silicon Transmission electron microscopy X ray diffraction
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  • 1[1]SZE S M. VLSI Techonology [M]. Singapore: McGrawHill, 1988: 55-97.
  • 2[2]EAGLESHAM D J. Semiconductor molecular-beam epitaxy at low temperatures [J]. Journal of Applied Physics, 1995,77: 3597- 3619.
  • 3[3]THIESEN J, IVANICZKO E, JONES K M, et al.Growth of epitaxial silicon at low temperatures using hot-wire chemical vapor deposition [J]. Applied Physics Letters,1999,75:992 - 994.
  • 4[4]MEYERSON B S, URAM K J, FRANCOISE K, et al.Cooperative growth phenomena in silicon/germanium low-temperature epitaxy [J]. Applied Physics Letters,1988, 53(25): 2555-2557.
  • 5叶志镇,曹青,张侃,陈伟华,汪雷,李先杭,赵炳辉,李剑光,卢焕明.UHV/CVD低温生长硅外延层的性能研究[J].Journal of Semiconductors,1998,19(8):565-568. 被引量:6
  • 6叶志镇.超高真空CVD极低温低压硅外延与高分辨TEM分析研究[J].Journal of Semiconductors,1994,15(12):832-837. 被引量:4
  • 7[7]RHODERICK E H. Metal-semiconductor contacts [M].Oxford: Oxford University Press, 1988.

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  • 1张晓丹,赵颖,高艳涛,朱锋,魏长春,孙建,耿新华,熊绍珍.微晶硅薄膜的制备及结构和稳定性研究[J].物理学报,2005,54(8):3910-3914. 被引量:7
  • 2Abstreiter G, Brugger H, Wolf T, et al. Strain-induced two-dimensional electron gas in selectively doped Si/SiGe superlatrices. Phys Rev Lett, 1985,54: 2441.
  • 3Ismail K, Arafa M, Saenger K L, et al. Extremely high electron mobility in Si/SiGe modulation-doped heterostructures.Appl Phys Lett, 1995,66:1077.
  • 4Paul D J. Silicon germanium heterostructures in electronics:the present and the future. Thin Solid Films, 1998,321:172.
  • 5Kasper Erich. Properties of strained and relaxed silicon germanium. IEEE, 1995.
  • 6Whall T E, Parker E H C. SiGe-heterostruetures for CMOS technology. Thin Solid Films, 2000,367: 250.
  • 7Trinkaus H, Hollander.B, Rongen St, et al. Strain relaxation mechanism for hydrogen-implanted SiGe/Si (100) heterostructures. Appl Phys Lett, 2000,76: 3552.
  • 8Luo Y H,Wan J,Forrest R L,et al. High-quality strain-relaxed SiGe films grown with low temperature Si buffer. J Appl Phys, 2001,89:8279.
  • 9Kasper E, Lyutovich K, Bauer M, et al. New virtual substrate concept for vertieal MOS transistors. Thin Solid Films, 1998,336:319.
  • 10Leitz C W, Currie M T, et al. Dislocation glide and blocking kinetics in compositionally graded SiGe/Si. J Appl Phys,2001(6):2730.

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