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紫外光固化导电胶的研究进展 被引量:3

Research Progress in UV-Curing Electric Conductive Adhesives
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摘要 紫外光固化导电胶是近年来发展出来的粘合剂新品种,本文主要从紫外光固化导电胶的固化机理、导电机理、组成、固化设备等方面进行综述。此外,还简要介绍了混合电路用导电胶的发展动向。 UV-curing electric conductive adhesive is a new kind bonding material developed in resent years.In this article,the UV-curing mechanism,electric conduction mechanism,adhesive component and the curing equipment are summarized.Meanwhile,the developing direction of electric conductive adhesives for compound electric circuits is also introduced.
作者 常英 刘彦军
出处 《化学与粘合》 CAS 2004年第6期346-350,共5页 Chemistry and Adhesion
基金 0 3年大连市科委留学回国基金
关键词 紫外光固化导电胶 粘合剂 固化机理 导电机理 固化设备 electric conductive adhesive UV-curing
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参考文献16

  • 1倪晓军,梁彤翔.导电胶的研究进展[J].电子元件与材料,2002,21(1):1-3. 被引量:54
  • 2倪晓军,梁彤祥,刘杨秋,符晓铭.精细电路连接用紫外光固化各向异性导电胶[J].电子元件与材料,2002,21(8):9-10. 被引量:16
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二级参考文献5

  • 1Lu D Q, Wong C P. A study of contact resistance of conductive adhesives based on anhydride-cured epoxy systems [J]. IEEE Trans Comp Packag Technol, 2000, 23: 440-446.
  • 2Wojciechowski D, Vanfleteren J, Reese E, et al. Electro-conductive adhesives for high density package and flip-chip interconnections [J]. Microelectron Reliab, 2000, 4: 1215-1226.
  • 3Chang S M, Jou J H, Hsieh A, et al. Characteristic study of anisotropic-conductive film for chip-on-film packaging [J]. Microelectron Reliab, 2001, 41: 2001-2009.
  • 4GB7124-86, 胶粘剂剪切冲击强度试验方法 [S].
  • 5Scherzer T, Decker U. Real-time FTIR-ATR spectroscopy to study the kinetics of ultrafast photopolymerization reactions induced by monochromatic UV light [J]. Vibr Spectrosc, 1999, 19: 385-398.

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