摘要
为了迎接无铅时代的到来,不少半导体公司正趋向选用预镀镍-钯金穴NiPdAuppf雪涂层的引线框架,以简化生产工艺。但是,这种方法需要仔细考虑NiPdAu涂层上金焊点的质量、其与修剪成形工具的兼容性以及选择正确的原材料组合穴用于粘结芯片的环氧树脂和塑封材料雪,以确保在260℃下达到1级MSL穴潮湿度敏感等级雪。将探讨装配过程的特性,以保证金焊点牢固地焊接在NiPbAu涂层上;如何优化选用适当的材料组合;修剪成形工具的修改以避免涂层出现机械破坏;以及NiPdAu涂层的可焊性评估。
With the advent of Pb-free conversion, some semiconductor companies are opting to implement Nickel Palladium Gold pre-plated (NiPdAu ppf) lead finish for process simplication purposes. This option, however, would need careful consideration on the quality of the Au-bonds on the NiPdAu layer, compatibility of the trim-and-form toolings to the NiPdAu finish and the selection of the right combination of raw materials (die attach epoxies and mold compounds) that will pass MSL Level 1 at 260℃. This paper will discuss the assembly characterization efforts to ensure a robust Au-bond connection onto the NiPdAu layer; the optimization studies in identifying the appropriate material set; the modification of the trim-and-form toolings to prevent any mechanical disturbance on the finish; and the evaluation for solderability of NiPdAu ppf.
出处
《电子工业专用设备》
2004年第12期26-31,共6页
Equipment for Electronic Products Manufacturing
关键词
装配
封装
可靠性
研究
Assembly
Package
Reliability
Overview
