摘要
本文用差热分析（DTA）,X 射线衍射分析,SEM 观察及磨削试验研究了镀 W 金刚石与铜合金结合剂界面成分、结构及结合性能。结果表明:在700～1250℃范围内,镀 W 层与金刚石发生界面反应,在金刚石表面外延生成岛状 WC 和 W<sub>2</sub>C 从而实现了金刚石与 W 镀层间的冶金结合,即金刚石表面金属化。镀 W 金刚石与铜合金的粘结强度可达4×10<sup>7</sup>Pa。用镀钨金刚石制成的磨块磨削比、出刃高度得到提高,金刚石的脱落率大幅度下降。
Interface composition,structure and bond properties between W-clad diamond and copper alloy are inverstigated by DTA analysis,X-ray diffr-action analysis,SEM observation and grinding test.Test results show that inte-rface reaction between W-clading and diamond occur at between 700～1250℃,the epitaxial islands of WC and W_2C are formed and grow on the diamond su-rface,therfore metallurgical bond of interface between diamond and copperaclloy is achieved.Bond strength between W clad diamond and copper alloy re-main at the level of 4×10~7Pa.The grinding property is improved greatly.
出处
《人工晶体学报》
EI
CAS
CSCD
1993年第1期68-72,共5页
Journal of Synthetic Crystals
基金
国家八.五科技攻关课题
关键词
镀层
金刚石
铜合金
钨
W-clading
diamond
copper alloy
interface
