摘要
用云纹干涉技术和热复制变形栅技术研究了双材料搭接试件界面区域的热应力和热变形。在云纹干涉实验中,提出了热复制硅橡胶变形栅的新技术并利用光載波技术将均匀热膨胀变形与热应力相关热变形分离,在实验的基础上给出了双材料界面及周围区域的热应力分布和角点处应力集中状态并对此进行了讨论。
In this paper thermal deformation and thermal stress of a bimaterial specimen were investigated by using high sensitive moire interferometry. In the moire interferometry thermal replicate method was developed for recording deformed specimen grating, and carrier fringe technique was used to separate the free thermal expansion from the thermal stress-induced deformation. Based on the experimental results, the thermal stress in interface and the stress concentration at the edge were discussed.
出处
《天津大学学报》
EI
CAS
CSCD
1993年第3期23-28,共6页
Journal of Tianjin University(Science and Technology)
基金
国家教委博士点基金
关键词
云纹干涉法
双材料
界面
热应力
moire interferometry, thermal replicate technique, thermal stress of a bimaterial in interface
