摘要
采用搅拌复合方法制备了SiCp Al 1 2Mg 0 6Si 0 1Ti 1 0Pb复合材料,通过透射电镜研究了复合材料的界面结构。复合材料中增强体SiC与基体合金的界面主要为SiC Al、SiC Pb、SiC Mg2Si,Pb在复合材料中主要以面心立方Pb相形式存在于SiC颗粒的界面上,部分SiC颗粒的界面存在Al4C3。界面Pb相中存在着Ti元素,由于合金元素之间的相互作用使基体合金中的Pb、Ti元素集中存在于SiC的界面上。
SiC_p/Al-1.2Mg-0.6Si-0.1Ti-1.0Pb composites were fabricated by mechanical stirring. Interfacial structure of the composite was investigated by means of conventional TEM. SiC/Al、SiC/Pb、SiC/Mg_2Si interfaces dominate in composite. Lead mainly exists at the SiC_p/Al interfaces as FCC crystal and there are some Al_4C_3. Titanium element was founded in interfacial Pb phase. For mutual action of alloy elements, Pb and Ti existed concentrated at SiC interfaces.
出处
《电子显微学报》
CAS
CSCD
北大核心
2004年第6期622-625,共4页
Journal of Chinese Electron Microscopy Society
