摘要
以甲基和苯基氯硅烷为单体,采用水解缩聚的方法合成有机硅树脂,并对影响有机硅树脂合成的有关因素进行了研究。结果表明,当水解温度为70℃,控制水用量n(H2O)／n(c1)在8:1-5:1的范围内时,可合成出易溶于甲苯的有机硅树脂。红外光谱(IR)显示,合成的硅树脂含有端羟基。采用热失重法(TG)、热失重的微分曲线法(DTG)和马弗炉烧蚀试验研究有机硅树脂耐的热性能和室温固化性能,并对KH-CL和三乙醇胺两种室温固化剂对硅树脂的耐热性能的影响进行了对比研究。结果表明,在氩气气氛下,硅树脂具有很高的耐热性能,它的起始分解温度为400℃,热失重主要由400-500℃时"解扣式"降解和500℃之后的"重排"降解引起。但在空气气氛下,由于有机基团的氧化分解,硅树脂的耐热性有所下降。KH-CL可使硅树脂在室温条件下固化,固化后硅树脂的耐热性能提高。
The silicone resin is synthesized using hydrolysis-polycondensation method from phenyl and methyl chlorosilane, and the factors influencing this synthesis are investigated. The results indicate that silicone resin can be synthesized when the hydrolysis temperature is 70°C and n(H2O)/n(Cl) is between 5:1 and 8:1. And the IR analysis shows that silicone resin possesses hydroxyl end group. The thermal properties are investigated using thermo-gravimetric analysis (TG), differential thermogravimetric analysis (DTG) and muffle furnace test, and the effects of curing agents, such as KH-CL and triethanolamine, on the thermal properties of silicone resin were also discussed. It is found that silicone resin possesses excellent thermal stability with onset degradation temperature at about 400°C, and its mass loss is mainly caused by the unzipped degradation occurred between 400 - 500°C, and the rearranged degradation occurred after 500°C. But its thermal properties decrease at air atmosphere due to the oxidative-degradation of organic groups. Silicone resin can cure at room temperature with KH-CL, and its thermal stability is improved after cured.
出处
《航空材料学报》
EI
CAS
CSCD
2005年第1期25-29,35,共6页
Journal of Aeronautical Materials
关键词
甲基苯基有机硅树脂
合成工艺
端羟基
室温固化
热降解
航空材料
Condensate treatment
Curing
Degradation
Heat resistance
Hydrothermal synthesis
Infrared spectroscopy
Polycondensation
Silicones
Thermogravimetric analysis
