摘要
本文评述了高性能板对覆铜板的基本要求,即对覆铜板的Tg温度、热膨胀系数CTE、介电常数εr、离子迁移CAF等的新要求。同时,对覆铜板介质层厚度的均匀性和平整度有了更高的要求,而特种覆铜板材料将会迅速增加。
This paper describes the basic demands of CCL for high-performance PCB, i.e higher performance of Tg, CTE, εr, CAF etc. At the same time, higher demands for eveness and coplanarity of the dielectrical thickness, and the special CCL Materials are rapidly increasing.
出处
《印制电路信息》
2003年第7期3-9,共7页
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