摘要
着重对泡沫材料“导电补偿机理”进行了描述。此外，就交联对电性能及泡沫发泡性的影响进行了探讨。
The conductive compensate mechanism of the plastic foam was described in detail. The effect of the cross link to the electrical properties and the foaming of the plastic foam was also discussed.
出处
《包装工程》
CAS
CSCD
1994年第2期62-64,共3页
Packaging Engineering
