摘要
本文研究了用于功率管钎焊的Ｐｂ－Ｓｎ－Ａｇ焊料，选用合适的腐蚀液，对这种焊料进行了金相组织和微观结构的分析，并对焊料与镀Ｎｉ的Ｃｕ框架的润湿性及焊接进行了观察，表明该焊料能与镀Ｎｉ的Ｃｕ框架和硅芯片很好地焊接，是适于功率管焊接的软焊料。
Pb-10Sn-2Ag solder was selectedfor power device.Using the suitable etching solution,the microstructure,wetting and soldering testof the solder on Ni-plated Cu substrate were observed.The results showed that the soldering ofthe solder and substrate was well and the solderwas suitable for power device.
出处
《功能材料》
EI
CAS
CSCD
1994年第1期88-91,共4页
Journal of Functional Materials
