摘要
本文研究了Ｘ射线残余应力测试中，表面处理所形成的附加应力层的分布，对去除该应力层所用的电解抛光工艺参数进行了探讨，回归了电解抛光方程式；并结合现场测试条件，提供了最佳抛光电流密度。
study was made fof the distribution of an additionalstress laver formed with surface treatment in measurementof X-ray residual stress,an approach was made for electro-polishing process paramcters used to eliminate the stresslayer, and electro-polishing equations were regressed.Theoptimurn electric current density for polishing was given incomhnation with measurement in situ.
出处
《化工机械》
CAS
北大核心
1994年第6期324-327,共4页
Chemical Engineering & Machinery
关键词
X射线
残余应力
电解抛光
表面处理
X-Ray,Spherical Tank,Residual Stress,Electro Polishing
