摘要
温升试验是低压电器型式试验项目之一。本文叙述了用单片机实现温升测试新方法的概况,并介绍了装置的性能、硬件设计及部分软件框图。
Temperature rise test is one of the tests of low voltage switchgcars. This paper presents a new method to measure the temperature rise of electrical devices by using single chip microcontrollers. It also describes the performances of an instrument meant to apply this new method, hardware designs and some program charts for the instrument. This instrument has shown many advantages and met all the designingtargcts.
出处
《上海工程技术大学学报》
CAS
1994年第2期56-61,共6页
Journal of Shanghai University of Engineering Science
关键词
温升试验
热电偶
微处理机
Temperature rise test Time constant Thermocouple Microprocessors
