摘要
针对硅热流量传感器的封装 ,给出了其一维简化理论模型 ,并采用有限元分析工具ANSYS/FLOTRAN ,建立了该封装结构的热模型 .模拟结果显示 ,该封装后的传感器的温度场与未封装传感器相似 ,证明陶瓷封装结构是可行的 ;同时比较了封装前后传感器性能的差异 ,并进一步分析了传感器的热性能和其特征尺寸的关系 .该模型的建立 ,可以减少大量的模拟分析过程 ,减小计算量 ,研究结果将为该传感器封装的进一步优化设计提供理论参考和依据 .
Based on the packaging of a silicon gas flow sensor,a simplified one-dimensional analytical model is given.The FEA thermal model of the sensor is also built with ANSYS/FLOTRAN.The simulation results show that the temperature field of the ceramic packaged sensor is similar to that of unpackaged one,which proves the feasibility of this packaging scheme.The performances of packaged and unpackaged sensor is compared and the influence of the structure parameters on the thermal performance of the sensor are also discussed in detail.The thermal model and its analysis provide a simple method for the optimization design of the packaging of the gas flow sensor.
基金
江苏省自然科学基金资助项目 (批准号 :BK2 0 0 3 0 5 2 )~~
关键词
有限元分析
硅热流量传感器
封装
热模拟
finite element analysis
silicon gas flow sensor
packaging
thermal simulation
