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硅直接键合界面附近的深能级研究 被引量:3

THE DEEP LEVEL STUDIES OF n-Si/n ̄(+)-Si INTERFACE IN SILICON DIRECT BONDING
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摘要 利用扩展电阻探针(SRP)和深能级瞬态谱(DLTS)技术详细研究了直接键合的n-Si/n ̄(+)-Si界面附近的深能级。实验结果表明,在直接键合的n-Si/n ̄(+)-Si界面n-Si一侧附近可观察到一个明显的电子陷阱E1(E_c-0.39eV)。E1可能是由若干个能级位置相近的陷阱迭加而成的,其浓度在10 ̄(13)-10 ̄(14)cm ̄(-3)之间。它可能是与制备键合材料的高温(1000-1100℃)处理过程中产生的空位和热应力有关。 he deep levels of n-Si/n ̄(+)-Si interface and near the interface in the n-Si havebeen studies using spread resistance probe(SRP)and deep level transient spectrosco-py(DLTS)techniques in silicon direct bonding.The experimental results show thata dominant electron trap,having energy level position of E_c-0.39eV and concentra-tion in the range of 10 ̄(13)-10 ̄(14)cm ̄(-3) was observed. This trap is strongly related tovacancies of n-Si/n ̄(+)-Si interface and near the interface in the n-Si induced by hightemperature(1000-1100℃)treatment in SDB processing.
出处 《物理学报》 SCIE EI CAS CSCD 北大核心 1994年第5期785-789,共5页 Acta Physica Sinica
基金 国家自然科学基金 浙江省自然科学基金
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