摘要
介绍了基于热膨胀效应的V型梁MEMS微执行器并联阵列结构,并对其进行结构设计、仿真和制作;为确定微执行器的结构参数同其位移和驱动力的关系,对V型悬臂梁进行了理论分析;为提高位移和驱动力,运用ANSYS对微执行器进行有限元分析,优化结构参数;根据模拟结果,采用SOI硅片和微细加工DRIE技术制作了这种V型梁微执行器并联阵列。
A MEMS V-shaped beam micro-actuator array based on thermal expansion is described,and the design,simulation and fabrication are presented. For predicting the relation between the structural parameters of the V-shaped beam and the displacement and actuating force,the theoretical analysis is developed. The structural parameters are optimized to improve the displacement and actuating force by means of FEM. Based on the result of simulation,the V-shaped beam thermal micro-actuator array is fabricated on a SOI wafer by DRIE.
出处
《微纳电子技术》
CAS
2005年第4期175-179,共5页
Micronanoelectronic Technology
