摘要
提出了用稀土合金CeCl3进行催渗的纯铜渗铝技术。采用渗铝—内氧化技术制备了Al2O3表面弥散铜基导电材料。研究了CeCl3合金催渗对渗铝层的影响和表面弥散层的显微组织及有关性能。结果表明:利用稀土合金CeCl3催渗的纯铜渗铝试样渗层厚度远高于同等工艺参数下未催渗的纯铜渗铝试样。内氧化后,能在渗铝层形成Al2O3弥散硬化层。
An aluminizing technique with RE CeCl_3 on pure copper is presented. Al_2O_3 particles dispersed on Cu surface have been fabricated by aluminizing and internal oxidation technique. The influence of the technologic parameters on aluminizing layer and the microstructure and properties of the aluminized copper after internal oxidation is studied. The results show that it has deeper aluminizing layer using RE CeCl_3 than that of without using RE CeCl_3 at the same technologic parameters. It is possible to generate Al_2O_3 dispersed hardening layer in the aluminized layer.
出处
《有色金属（冶炼部分）》
CAS
北大核心
2005年第2期47-49,共3页
Nonferrous Metals（Extractive Metallurgy)
基金
河南省重大科技攻关项目(0122021300)
河南科技大学科研基金资助项目(2002QN03)
关键词
纯铜
渗铝
内氧化
弥散强化
Copper
Aluminizing
Internal oxidation
Dispersion strengthening
