摘要
介绍利用俄歇电子能谱分析(AES)法对元素深度分布进行分析,利用扫描电子显微镜(SEM)进行表面形貌分析,并通过稀盐酸腐蚀比较试验,分析评价了PCB镀金层致密性。
The PCB coating gold layer compact ness was studied through the element depth distribution analysis with AES, surface topography analysis with SEM and dilute hydrochloric acid erosion comparison experiment.
出处
《电子产品可靠性与环境试验》
2005年第2期25-27,共3页
Electronic Product Reliability and Environmental Testing
关键词
印制线路板
镀金层
致密
腐蚀
微颗粒
表面形貌
PCB
coating gold layer
compactness
erosion
micro-particles
surface topography
