摘要
随着工艺的发展,器件尺寸的不断缩小,PMOSFET受负温度不稳定性(NBTI)效应影响而失效的现象愈来愈严重,NBTI效应的影响成为器件可靠性的一个焦点问题。本文综述了NBTI效应的产生机理、影响因素、减缓方法及其相关的一些前沿问题。
With the advanced processes, the feature size of the devices keeps diminishing, whichleads to more frequent failure of PMOSFET due to NBTI effects that now becomes a focus of devicereliability. NBTI effect is reviewed on mechanisms, affecting factors, alleviating methods and therelevant problems.
出处
《半导体技术》
CAS
CSCD
北大核心
2005年第5期62-66,27,共6页
Semiconductor Technology