摘要
为研究增强体含量对电子封装用Si颗粒增强铝基复合材料热物理性能的影响,采用挤压铸造法制备了以高纯Si粉为增强体,LD11铝合金为基体,体积分数分别为55%、60%和65%的3种复合材料.利用金相显微镜、热膨胀分析仪、热导率测试仪等多种手段对复合材料的微观组织及热物理性能进行了研究,并对试验结果进行数值模拟.显微组织观察表明,复合材料的铸态组织均匀、致密.通过改变复合材料增强体的含量,复合材料的热膨胀系数介于(8.1～12)×10-6/℃之间可调,热导率大干87.7W/m·℃,满足电子封装用材料的要求.Sip/LD11复合材料的热膨胀系数介于Rom模型和Turnet模型之间,Kerner模型能够更好地预测Sip/LD11复合材料的热膨胀系数.热导率计算结果均大于测试值.
For the purpose of studying on the influence of the volume fraction of reinforcements on thermophysical properties of Sip/LD11 composites used for electric packaging, Sip/Al composites with volume fractions of 55%,60% and 65% were fabricated by squeeze casting technology. By using optical microscope, dilatometer, thermal conductivity tester, the microstructure and thermo-physical properties were studied. The Sip/LDH composites with high volume fraction of silicon particles were fabricated by squeeze-casting technique. Microstructure observations indicate that the composites are dense and homogenous. By changing the content of silicon particles, the CTEs of Sip/LD11 composite are tailorable in the range of (8. 1-12)×10-6/℃ and their thermal conductivities are larger than 87.7 W/m·℃. The properties can satisfy the demands of electronic packaging applications. It was found that the experimental CTEs were between the ROM and the Turner model, and was closer to the Kerner model. The calculating results of thermal conductivity are larger than the test results.
出处
《材料科学与工艺》
EI
CAS
CSCD
北大核心
2005年第2期171-174,共4页
Materials Science and Technology
关键词
Si颗粒
铝基复合材料
热膨胀
热导率
电子封装
Si particles
aluminum matrix composite
thermal expansion
thermal conductivity
electronic packaging
