摘要
以轧膜成型工艺制备的BaTiO3基热敏电阻(PTCR)坯片为对象,研究了烧结工艺对其电性能的影响。结果表明,通过控制烧结温度的各参数,可优化成BaTiO3基热敏电阻的电性能。且获得室温电阻低于10Ω、升阻比达5个数量级且耐电压高于50V/mm的片式PTCR瓷片,尺寸为8mm×5mm×0.22mm。
In this paper, many experiments are conducted to discuss the influences of various sintering conditions on the electrical property of chip PTCR formed by rolling process.The results show that the preparation of BaTiO_3-based chip PTCR with good electrical property could be made easier by controlling the parameters of sinter-system. The size of sample finally obtained is 8 mm×5 mm×0.22 mm,with its R_(25)<10 Ω,V_b>50 V/mm and β>10~5.
出处
《压电与声光》
CAS
CSCD
北大核心
2005年第3期267-269,共3页
Piezoelectrics & Acoustooptics
基金
国家"八六三"计划基金资助项目(2001AA325040)
