摘要
为研究锌基合金钎焊接头界面区的组织、性能及其钎焊接头的结合强度,本文用光学显微镜、扫描电镜、X射线衍射等分析手段,对界面区的微观组织形态及其相组成进行了研究分析;结果表明,用研制的新型高强软钎料钎焊锌基合金,获得的钎焊接头界面区中局部有交互结晶产生;界面区组织构成较复杂,既有Cd、Sn、Zn固溶体,又有少量的细小的Mg2Sn、MgZn等化合物;固溶体可以提高钎焊接头的强度和塑性,少量细小的化合物可强化基体组织,有利于强度的提高;但连续层状的金属间化合物可引起钎焊接头的脆化,使其性能降低.
In order to study the microstructure, characteristics of the interfacial region and the joint strength of the soldering joint. In this paper, analytic instruments such as OM, SEM and X-ray diffraction are used to investigate and analyze the microstructure and the phase composition of the interfacial region. The results indicate that, interactive crystallization exists in part of the interfacial region by using a new developed kind of high strength soldering filler metal. Both solid solution of Cd,Sn,Zn and small amounts of fine grained compounds of Mg_2Sn,MgZn are founded. Solid solution can improve the strength and plasticity, and small amounts of fine-grained compounds can strengthen the matrix, which is beneficial to improve the joint strength. However, successive laminate of intermetallic compounds will result in embitterment and deteriorate the properties of the joint.
出处
《材料科学与工艺》
EI
CAS
CSCD
北大核心
2005年第3期323-325,共3页
Materials Science and Technology
基金
山东省自然科学基金资助项目(Y2201F09).
