摘要
研究了SMT焊点在随机振动条件下引起的振动疲劳情况,给出了SMT焊点半经验随机振动疲劳寿命累积模型,并通过对某SMT电路板进行随机振动疲劳测试,验证了模型的正确性。
According to random theory, a random fatigue semi-empirical model of SMT solder joint in random vibration condition is created. Compared with random vibration test results in Ref. [5] its result is good enough to predict solder joint fatigue life.
出处
《振动与冲击》
EI
CSCD
北大核心
2005年第2期24-26,36,共4页
Journal of Vibration and Shock
基金
航天技术创新基金资助项目
关键词
SMT焊点
随机振动
疲劳寿命
Error analysis
Fatigue of materials
Mathematical models
Networks (circuits)
Surface mount technology
Vibrations (mechanical)
